PCB线路板, 喷锡镀金电路板

PCB Manufacturing Capabilities:

Layers

1-20 Layers

Laminate

FR4, H-TG, CEM, Aluminum, Copper Base, Teflon, Rogers,

Ceramics, Iron Base

Max. Board Size

1200*480mm

Min.Board Thickness

2-Layer 0.15mm

4-Layer 0.4mm

6-Layer 0.6mm

8-Layer 1.5mm

10-Layer 1.6-2.0mm

Min. Line Width/Trace

0.1mm(4mil)

Max. Copper Thickness

10 OZ

Min. S/M Pitch

0.1mm(4mil)

Max. S/M Pitch

0.2mm(8mil)

Min. Hole Dia.

0.2mm(8mil)

Hole Dia. Tolerance(PTH)

±0.05mm(2mil)

Hole Dia. Tolerance(NPTH)

±0.05mm(2mil)

Hole Position Deviation

±0.05mm(2mil)

Outline Tolerance

±0.1mm(4mil)

Twist/Bent

0.75%

Insulation Resistance

>1012Ω Normal

Electric Strength

>1.3kv/mm

S/M Abrasion

>6H

Thermal Stress

288℃10Sec

Test Voltage

50-300V

Min. Blind/Buried Via

0.15mm(6mil)

Surface Treatment

OSP,HASL,LF-HASL,ENIG,Gold/Au Plating,Immersion Ag/Silver,

Ag/Silver Plating,Immersion Tin,Tin Plating

Testing

E-test, Fly probe test